Product Outline<\/span><\/h2>\n\n\n- Crossing wires made possible with polyimide-coated copper wires.
Realizing high density wiring and reduced layer count<\/li>\n - A high degree of wiring design freedom and ease of isometric length wiring <\/li>\n
- Uniform copper wires used in the signal wiring reduce electrical characteristics variability
Low variability among manufacturing lots ensure stable characteristics<\/li>\n<\/ul>\n\nManufacturing locations\uff1aShimodate Plant<\/span><\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n\n\n\nFeatures<\/span><\/h2>\n\n\n\n01<\/span>Wiring resistance reduced by nearly 70%<\/p>\nBecause MWB uses high-precision wires with a diameter tolerance of +\/- 3 \u03bcm, impedance stability is superior to the signal lines of conventional etched steel foil wiring boards. In addition, signal line resistance per 254mm (10 inches) can be reduced by as much as 70%.<\/p>\n<\/div>\n
\n![\"Wiring](\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/mwb_img_1.jpg\")
<\/p>\n<\/div>\n<\/div>\n
\n\n02<\/span>Insulated wires<\/p>\nDiameter is selectable to match the application
Users can choose among wire diameters of 65\u03bcm, 80\u03bcm, and 100\u03bcm. We also have begun offering 50\u03bcm wire in small quantities, so please feel free to let us know your needs.<\/p>\n<\/div>\n
\n![\"Insulated](\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/mwb_img_2.jpg\")
<\/p>\n<\/div>\n<\/div>\n
\n\n03<\/span>Reduced crosstalk<\/p>\nMWB allows for easy implementation of many design strategies to reduce crosstalk: diagonal wiring, specification of wiring plane, restrictions on length of parallel wire length, pairing with ground lines, among others. <\/p>\n<\/div>\n
\n![\"Reduced](\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/mwb_img_3.jpg\")
<\/p>\n<\/div>\n<\/div>\n
\n\n04<\/span>Aspect ratios up to 30<\/p>\nBy thru-hole plating, we cover a broad range of aspect ratios.<\/p>\n<\/div>\n
\n![\"Aspect](\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/mwb_img_4.jpg\")
<\/p>\n<\/div>\n<\/div>\n
\n\n05<\/span>Easy signal synchronization<\/p>\nMWB allows crossed wiring without thru-holes, so signal synchronization by techniques such as isometric length wiring and solid pattern wiring can be done easily.<\/p>\n<\/div>\n
\n![\"Easy](\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/mwb_img_5.jpg\")
<\/p>\n<\/div>\n<\/div>\n
\n\n06<\/span>High layer count PWBs can be made denser<\/p>\nMWB allows horizontal, vertical and diagonal wiring in a plane for increased wiring density, which enables not only signal layer count reduction, but ground layers can also be reduced for impedance control.<\/p>\n<\/div>\n
\n![\"High](\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/mwb_img_6.jpg\")
<\/p>\n<\/div>\n<\/div>\n
\n\n07<\/span>Concurrent wiring to achieve the shortest wiring path<\/p>\nHorizontal, vertical and diagonal wiring are continuous to obtain the shortest wiring path.<\/p>\n<\/div>\n
\n![\"Concurrent](\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/mwb_img_7.jpg\")
<\/p>\n<\/div>\n<\/div>\n
\n\n08<\/span>Wire intersection insulation can withstand over 500V.<\/p>\nCrossing wires is no problem
Insulated wires are used, so insulation strength where wires cross is not an issue. <\/p>\n<\/div>\n
\n![\"Wire](\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/mwb_img_8.jpg\")
<\/p>\n<\/div>\n<\/div>\n
\n\n09<\/span>Ample current carrying capacity and shielding of power supply and internal layers<\/p>\n Power supply and ground patterns are formed by 18\u03bcm thick copper foil for plenty to current handling and shielding. Current can also be distributed among multiple layers.<\/p>\n<\/div>\n
\n![\"Ample](\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/mwb_img_9.jpg\")
<\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/section>\n\nMWB (multi wiring board) manufacturing process<\/h3>\n\n\n- 1<\/span>Circuit formation<\/dt>\n
- After forming the circuit on a copper-clad laminate, an adhesive sheet is attached, and the copper wiring is formed on top. After the copper wiring, a visual inspection is performed, after which the multi wiring unit is formed with a copper foil lamination.<\/span><\/dd>\n<\/dl>\n
\n- 2<\/span>Lamination press<\/dt>\n
- After forming the circuit on the multi wiring unit surface, multiple multi wiring units are laminated together.<\/dd>\n<\/dl>\n
\n- 3<\/span>Hole drilling<\/dt>\n
- The pressed laminates are drilled to form the holes.<\/dd>\n<\/dl>\n
\n- 4<\/span>Plating<\/dt>\n
- The circuits on each layer are connecting with plated thru holes.<\/dd>\n<\/dl>\n
\n- 5<\/span>Outer layer formation<\/dt>\n
- The outer layer circuit is formed on the plated multilayer board.<\/dd>\n<\/dl>\n
\n- 6<\/span>Open\/Short test<\/dt>\n
- Check is done on a open\/short test fixture. After surface treatment and visual inspection both cleared, the PWBs are finally shipped.<\/dd>\n<\/dl>\n<\/div>\n<\/section>\n
\nTypical applications<\/h3>\n\n\nProbe cards<\/h4>\n
![\"Probe](\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/mwb_flex_1.jpg\")
<\/p>\n
Probe cards are fixtures used to check the quality of wafers used in the semiconductor manufacturing process. The importance of inspection precision is increasing along with semiconductor demand. Lincstech’s printed wiring boards have the top share in semiconductor inspection processes. <\/p>\n<\/div>\n
\nIC testers<\/h4>\n
![\"IC](\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/mwb_flex_2.jpg\")
<\/p>\n
These fixtures are used in the quality and condition tests in the IC manufacturing process. In order to reduce cost, multiple DUTs must be tested at once while maintaning test accuracy. Lincstech PWB’s high wiring density allows simultaneous and accurate testing of multiple DUTs
\u203bDUT: Device Under Test<\/p>\n<\/div>\n<\/div>\n
- \n
- Crossing wires made possible with polyimide-coated copper wires.
Realizing high density wiring and reduced layer count<\/li>\n - A high degree of wiring design freedom and ease of isometric length wiring <\/li>\n
- Uniform copper wires used in the signal wiring reduce electrical characteristics variability
Low variability among manufacturing lots ensure stable characteristics<\/li>\n<\/ul>\n\nManufacturing locations\uff1aShimodate Plant<\/span><\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n
\n\n\n Features<\/span><\/h2>\n
\n\n\n01<\/span>Wiring resistance reduced by nearly 70%<\/p>\n
Because MWB uses high-precision wires with a diameter tolerance of +\/- 3 \u03bcm, impedance stability is superior to the signal lines of conventional etched steel foil wiring boards. In addition, signal line resistance per 254mm (10 inches) can be reduced by as much as 70%.<\/p>\n<\/div>\n
\n<\/p>\n<\/div>\n<\/div>\n\n\n02<\/span>Insulated wires<\/p>\n
Diameter is selectable to match the application
Users can choose among wire diameters of 65\u03bcm, 80\u03bcm, and 100\u03bcm. We also have begun offering 50\u03bcm wire in small quantities, so please feel free to let us know your needs.<\/p>\n<\/div>\n\n<\/p>\n<\/div>\n<\/div>\n\n\n03<\/span>Reduced crosstalk<\/p>\n
MWB allows for easy implementation of many design strategies to reduce crosstalk: diagonal wiring, specification of wiring plane, restrictions on length of parallel wire length, pairing with ground lines, among others. <\/p>\n<\/div>\n
\n<\/p>\n<\/div>\n<\/div>\n\n\n04<\/span>Aspect ratios up to 30<\/p>\n
By thru-hole plating, we cover a broad range of aspect ratios.<\/p>\n<\/div>\n
\n<\/p>\n<\/div>\n<\/div>\n\n\n05<\/span>Easy signal synchronization<\/p>\n
MWB allows crossed wiring without thru-holes, so signal synchronization by techniques such as isometric length wiring and solid pattern wiring can be done easily.<\/p>\n<\/div>\n
\n<\/p>\n<\/div>\n<\/div>\n\n\n06<\/span>High layer count PWBs can be made denser<\/p>\n
MWB allows horizontal, vertical and diagonal wiring in a plane for increased wiring density, which enables not only signal layer count reduction, but ground layers can also be reduced for impedance control.<\/p>\n<\/div>\n
\n<\/p>\n<\/div>\n<\/div>\n\n\n07<\/span>Concurrent wiring to achieve the shortest wiring path<\/p>\n
Horizontal, vertical and diagonal wiring are continuous to obtain the shortest wiring path.<\/p>\n<\/div>\n
\n<\/p>\n<\/div>\n<\/div>\n\n\n08<\/span>Wire intersection insulation can withstand over 500V.<\/p>\n
Crossing wires is no problem
Insulated wires are used, so insulation strength where wires cross is not an issue. <\/p>\n<\/div>\n\n<\/p>\n<\/div>\n<\/div>\n\n\n09<\/span>Ample current carrying capacity and shielding of power supply and internal layers<\/p>\n
Power supply and ground patterns are formed by 18\u03bcm thick copper foil for plenty to current handling and shielding. Current can also be distributed among multiple layers.<\/p>\n<\/div>\n
\n<\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/section>\n\n MWB (multi wiring board) manufacturing process<\/h3>\n
\n- \n
- 1<\/span>Circuit formation<\/dt>\n
- After forming the circuit on a copper-clad laminate, an adhesive sheet is attached, and the copper wiring is formed on top. After the copper wiring, a visual inspection is performed, after which the multi wiring unit is formed with a copper foil lamination.<\/span><\/dd>\n<\/dl>\n
- \n
- 2<\/span>Lamination press<\/dt>\n
- After forming the circuit on the multi wiring unit surface, multiple multi wiring units are laminated together.<\/dd>\n<\/dl>\n
- \n
- 3<\/span>Hole drilling<\/dt>\n
- The pressed laminates are drilled to form the holes.<\/dd>\n<\/dl>\n
- \n
- 4<\/span>Plating<\/dt>\n
- The circuits on each layer are connecting with plated thru holes.<\/dd>\n<\/dl>\n
- \n
- 5<\/span>Outer layer formation<\/dt>\n
- The outer layer circuit is formed on the plated multilayer board.<\/dd>\n<\/dl>\n
- \n
- 6<\/span>Open\/Short test<\/dt>\n
- Check is done on a open\/short test fixture. After surface treatment and visual inspection both cleared, the PWBs are finally shipped.<\/dd>\n<\/dl>\n<\/div>\n<\/section>\n
\n Typical applications<\/h3>\n
\n\nProbe cards<\/h4>\n
<\/p>\nProbe cards are fixtures used to check the quality of wafers used in the semiconductor manufacturing process. The importance of inspection precision is increasing along with semiconductor demand. Lincstech’s printed wiring boards have the top share in semiconductor inspection processes. <\/p>\n<\/div>\n
\nIC testers<\/h4>\n
<\/p>\nThese fixtures are used in the quality and condition tests in the IC manufacturing process. In order to reduce cost, multiple DUTs must be tested at once while maintaning test accuracy. Lincstech PWB’s high wiring density allows simultaneous and accurate testing of multiple DUTs
\u203bDUT: Device Under Test<\/p>\n<\/div>\n<\/div>\n - Check is done on a open\/short test fixture. After surface treatment and visual inspection both cleared, the PWBs are finally shipped.<\/dd>\n<\/dl>\n<\/div>\n<\/section>\n
- The outer layer circuit is formed on the plated multilayer board.<\/dd>\n<\/dl>\n
- The circuits on each layer are connecting with plated thru holes.<\/dd>\n<\/dl>\n
- The pressed laminates are drilled to form the holes.<\/dd>\n<\/dl>\n
- After forming the circuit on the multi wiring unit surface, multiple multi wiring units are laminated together.<\/dd>\n<\/dl>\n
- After forming the circuit on a copper-clad laminate, an adhesive sheet is attached, and the copper wiring is formed on top. After the copper wiring, a visual inspection is performed, after which the multi wiring unit is formed with a copper foil lamination.<\/span><\/dd>\n<\/dl>\n
- 1<\/span>Circuit formation<\/dt>\n