Product Outline<\/span><\/h2>\n\n\n- Up to 96 layers and 7.4mm thickness (actual max.)
Many parts can be mounted while maintaining high yield and circuit formation accuracy. <\/li>\n - PWBs with excellent throwing power and high quality<\/li>\n
- Product size up to 633 x 550mm. Perfectly suited for use in semiconductor inspection fixtures and communications systems.<\/li>\n
- Suitable for high speed communications and high frequency characteristics, strong introduction record in server and cloud systems<\/li>\n<\/ul>\n\n
Manufacturing locations\uff1a
Shimodate Plant<\/span>LCS<\/span><\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n\n\n\nFeatures<\/span><\/h2>\n\n\n\n01<\/span>Up to 96 layers and 7.4mm thickness
High layer count and high density<\/p>\nUses many of our original technologies in lamination, drilling, plating and others in the manufacturing process. We also perform highly accurate simulations. With these technologies, we realize high layer count and high density characteristics.<\/p>\n<\/div>\n
\n![\"Up](\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/mlb_img_1.jpg\")
<\/p>\n<\/div>\n<\/div>\n
\n\n02<\/span>Excellent high speed communications and high frequency performance<\/p>\nBy a combination of stubless structure by back drilling and high frequency materials, high frequency electrical characteristics are excellent, making it suitable for high speed communications.<\/p>\n<\/div>\n
\n![\"Excellent](\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/mlb_img_2.jpg\")
<\/p>\n<\/div>\n<\/div>\n
\n\n03<\/span>Excellent throwing power (uniform plating)<\/p>\nExcellent throwing power is achieved with our original electroless copper plating technology. These PWBs deliver high performance.<\/p>\n<\/div>\n
\n![\"Excellent](\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/mlb_img_3.jpg\")
<\/p>\n<\/div>\n<\/div>\n
\n\n04<\/span>Product size up to 633 x 550mm
Recommended for large boards<\/p>\nSizes up to 633 x 550mm are possible, making it suitable for use in semiconductor inspection fixtures and communications devices<\/p>\n<\/div>\n
\n![\"Product](\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/mlb_img_4.jpg\")
<\/p>\n<\/div>\n<\/div>\n
\nDimensions Evaluation Board Measured Values vs. Specifications
(633.0\u00d7523.4mm)<\/p>\n
\n\n\n\u9805\u76ee<\/th>\n \u5358\u4f4d<\/td>\n \u30b9\u30da\u30c3\u30af<\/td>\n<\/tr>\n \n\u539a\u307f<\/th>\n mm<\/td>\n t7.4<\/td>\n<\/tr>\n \n\u69cb\u9020<\/th>\n \u30fc<\/td>\n Through<\/td>\n<\/tr>\n \n\u6750\u8cea<\/th>\n \u30fc<\/td>\n E-679 (FR-4),
MEGTRON 6<\/td>\n<\/tr>\n \n\u5c64\u6570<\/th>\n Layers<\/td>\n 50
(SIG:2, GND:48)<\/td>\n<\/tr>\n<\/table>\n\n\n\u9805\u76ee<\/th>\n \u5358\u4f4d<\/td>\n \u30b9\u30da\u30c3\u30af<\/td>\n<\/tr>\n \nInner
Copper<\/th>\n Oz<\/td>\n 1<\/td>\n<\/tr>\n \n\u6700\u5c0f
\u30d4\u30c3\u30c1\u63a5\u5408<\/th>\n mm<\/td>\n 0.8<\/td>\n<\/tr>\n \n\u6700\u5c0f
\u30c9\u30ea\u30eb\u5f84<\/th>\n mm<\/td>\n mm<\/td>\n<\/tr>\n \nBGA
area size <\/th>\n mm<\/td>\n 74.4<\/td>\n<\/tr>\n<\/table>\n<\/div>\n<\/div>\n<\/div>\n<\/section>\n\nDimensions Evaluation Board Measured Values vs. Specifications
(633.0\u00d7523.4mm)<\/h3>\n
\u203bThe table can be viewed by scrolling left and right.<\/span><\/p>\n\n\n\nItem<\/th>\n Condition
\u30fb
Method<\/th>\n Unit<\/th>\n Spec.\/
Target<\/th>\n Result<\/th>\n<\/tr>\n \nE-679 (FR-4)<\/th>\n MEGTRON 6<\/th>\n<\/tr>\n \nThickness<\/th>\n Micrometer<\/td>\n mm<\/td>\n 7.4\u00b10.6<\/td>\n Avg.7.285<\/td>\n Avg.7.317<\/td>\n<\/tr>\n \nWarpage<\/th>\n Thickness gauge<\/td>\n mm<\/td>\n \u22661<\/td>\n Max.0.5<\/td>\n Max.0.5<\/td>\n<\/tr>\n \nBGA
Flatness<\/th>\n 3D CMM<\/td>\n mm<\/td>\n \u22660.05<\/td>\n Max.0.007<\/td>\n Max.0.057<\/td>\n<\/tr>\n \nSolder mask
opening dia.<\/th>\n 3D CMM<\/td>\n mm<\/td>\n 0.40\u00b10.05<\/td>\n Avg.0.394<\/td>\n Avg.0.402<\/td>\n<\/tr>\n \nPlating Thickness
\uff08TH\uff09<\/th>\n Cross-section<\/td>\n \u03bcm<\/td>\n Avg. over 20<\/td>\n Avg.26.7<\/td>\n Avg.27.5<\/td>\n<\/tr>\n \nCharacteristic
impedance (Z0)<\/th>\n TDR<\/td>\n \u03a9<\/td>\n 50\u00b15<\/td>\n 47.6~49.0<\/td>\n 47.8~49.5<\/td>\n<\/tr>\n<\/table>\n<\/div>\n<\/section>\n\nTypical applications<\/h3>\n\n\nProbe cards<\/h4>\n
![\"Probe](\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/mlb_flex_1.jpg\")
<\/p>\n
Probe cards are fixtures used to check the quality of wafers used in the semiconductor manufacturing process. The importance of inspection precision is increasing along with semiconductor demand. Lincstech\u2019s printed wiring boards have the top share in semiconductor inspection processes.<\/p>\n<\/div>\n
\nIC testers<\/h4>\n
![\"IC](\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/mlb_flex_2.jpg\")
<\/p>\n
These fixtures are used in the quality and condition tests in the IC manufacturing process. In order to reduce cost, multiple DUTs must be tested at once while maintaning test accuracy. Lincstech PWB\u2019s high wiring density allows simultaneous and accurate testing of multiple DUTs
\u203bDUT: Device Under Test<\/p>\n<\/div>\n
\nPerformance boards<\/h4>\n
![\"Performance](\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/mlb_flex_3.jpg\")
<\/p>\n
A board that transmits the necessary test signal between the probe card and test head during semiconductor electric performance inspections. Lincstech’s printed wiring boards enable high quality inspection, making them suitable for performance boards.<\/p>\n<\/div>\n
\nDigital swtiching systems<\/h4>\n
![\"Digital](\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/mlb_flex_4.jpg\")
<\/p>\n
As IP telephony progresses, the demand for telephone switchboards (PBX) that use internet connections is expanding. Use high quality PWBs to achieve clear, reliable communications.<\/p>\n<\/div>\n
\nServers<\/h4>\n
![\"Servers\"](\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/mlb_flex_5.jpg\")
<\/p>\n
Lincstech’s PWBs make communications speeds faster, further improving server data processing speeds. The major companies supporting the high speed communications industry use these PWBs. Lincstech’s unique technology is at work here, too.<\/p>\n<\/div>\n
\nIndustrial equipment<\/h4>\n
![\"Industrial](\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/mlb_flex_6.jpg\")
<\/p>\n
Lincstech PWBs providing both high density wiring and high reliability are an excellent match for industrial machines that propel automation and productivity improvements. Lincstech has a long history of supporting makers across the spectrum in their development work.<\/p>\n<\/div>\n<\/div>\n
- \n
- Up to 96 layers and 7.4mm thickness (actual max.)
Many parts can be mounted while maintaining high yield and circuit formation accuracy. <\/li>\n - PWBs with excellent throwing power and high quality<\/li>\n
- Product size up to 633 x 550mm. Perfectly suited for use in semiconductor inspection fixtures and communications systems.<\/li>\n
- Suitable for high speed communications and high frequency characteristics, strong introduction record in server and cloud systems<\/li>\n<\/ul>\n\n
Manufacturing locations\uff1a
Shimodate Plant<\/span>LCS<\/span><\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n\n\n\n Features<\/span><\/h2>\n
\n\n\n01<\/span>Up to 96 layers and 7.4mm thickness
High layer count and high density<\/p>\nUses many of our original technologies in lamination, drilling, plating and others in the manufacturing process. We also perform highly accurate simulations. With these technologies, we realize high layer count and high density characteristics.<\/p>\n<\/div>\n
\n<\/p>\n<\/div>\n<\/div>\n\n\n02<\/span>Excellent high speed communications and high frequency performance<\/p>\n
By a combination of stubless structure by back drilling and high frequency materials, high frequency electrical characteristics are excellent, making it suitable for high speed communications.<\/p>\n<\/div>\n
\n<\/p>\n<\/div>\n<\/div>\n\n\n03<\/span>Excellent throwing power (uniform plating)<\/p>\n
Excellent throwing power is achieved with our original electroless copper plating technology. These PWBs deliver high performance.<\/p>\n<\/div>\n
\n<\/p>\n<\/div>\n<\/div>\n\n\n04<\/span>Product size up to 633 x 550mm
Recommended for large boards<\/p>\nSizes up to 633 x 550mm are possible, making it suitable for use in semiconductor inspection fixtures and communications devices<\/p>\n<\/div>\n
\n<\/p>\n<\/div>\n<\/div>\n\nDimensions Evaluation Board Measured Values vs. Specifications
(633.0\u00d7523.4mm)<\/p>\n\n\n
\n \u9805\u76ee<\/th>\n \u5358\u4f4d<\/td>\n \u30b9\u30da\u30c3\u30af<\/td>\n<\/tr>\n \n \u539a\u307f<\/th>\n mm<\/td>\n t7.4<\/td>\n<\/tr>\n \n \u69cb\u9020<\/th>\n \u30fc<\/td>\n Through<\/td>\n<\/tr>\n \n \u6750\u8cea<\/th>\n \u30fc<\/td>\n E-679 (FR-4),
MEGTRON 6<\/td>\n<\/tr>\n\n \u5c64\u6570<\/th>\n Layers<\/td>\n 50
(SIG:2, GND:48)<\/td>\n<\/tr>\n<\/table>\n\n
\n \u9805\u76ee<\/th>\n \u5358\u4f4d<\/td>\n \u30b9\u30da\u30c3\u30af<\/td>\n<\/tr>\n \n Inner
Copper<\/th>\nOz<\/td>\n 1<\/td>\n<\/tr>\n \n \u6700\u5c0f
\u30d4\u30c3\u30c1\u63a5\u5408<\/th>\nmm<\/td>\n 0.8<\/td>\n<\/tr>\n \n \u6700\u5c0f
\u30c9\u30ea\u30eb\u5f84<\/th>\nmm<\/td>\n mm<\/td>\n<\/tr>\n \n BGA
area size <\/th>\nmm<\/td>\n 74.4<\/td>\n<\/tr>\n<\/table>\n<\/div>\n<\/div>\n<\/div>\n<\/section>\n \n Dimensions Evaluation Board Measured Values vs. Specifications
(633.0\u00d7523.4mm)<\/h3>\n\u203bThe table can be viewed by scrolling left and right.<\/span><\/p>\n
\n\n
\n Item<\/th>\n Condition
\u30fb
Method<\/th>\nUnit<\/th>\n Spec.\/
Target<\/th>\nResult<\/th>\n<\/tr>\n \n E-679 (FR-4)<\/th>\n MEGTRON 6<\/th>\n<\/tr>\n \n Thickness<\/th>\n Micrometer<\/td>\n mm<\/td>\n 7.4\u00b10.6<\/td>\n Avg.7.285<\/td>\n Avg.7.317<\/td>\n<\/tr>\n \n Warpage<\/th>\n Thickness gauge<\/td>\n mm<\/td>\n \u22661<\/td>\n Max.0.5<\/td>\n Max.0.5<\/td>\n<\/tr>\n \n BGA
Flatness<\/th>\n3D CMM<\/td>\n mm<\/td>\n \u22660.05<\/td>\n Max.0.007<\/td>\n Max.0.057<\/td>\n<\/tr>\n \n Solder mask
opening dia.<\/th>\n3D CMM<\/td>\n mm<\/td>\n 0.40\u00b10.05<\/td>\n Avg.0.394<\/td>\n Avg.0.402<\/td>\n<\/tr>\n \n Plating Thickness
\uff08TH\uff09<\/th>\nCross-section<\/td>\n \u03bcm<\/td>\n Avg. over 20<\/td>\n Avg.26.7<\/td>\n Avg.27.5<\/td>\n<\/tr>\n \n Characteristic
impedance (Z0)<\/th>\nTDR<\/td>\n \u03a9<\/td>\n 50\u00b15<\/td>\n 47.6~49.0<\/td>\n 47.8~49.5<\/td>\n<\/tr>\n<\/table>\n<\/div>\n<\/section>\n \n Typical applications<\/h3>\n
\n\nProbe cards<\/h4>\n
<\/p>\nProbe cards are fixtures used to check the quality of wafers used in the semiconductor manufacturing process. The importance of inspection precision is increasing along with semiconductor demand. Lincstech\u2019s printed wiring boards have the top share in semiconductor inspection processes.<\/p>\n<\/div>\n
\nIC testers<\/h4>\n
<\/p>\nThese fixtures are used in the quality and condition tests in the IC manufacturing process. In order to reduce cost, multiple DUTs must be tested at once while maintaning test accuracy. Lincstech PWB\u2019s high wiring density allows simultaneous and accurate testing of multiple DUTs
\u203bDUT: Device Under Test<\/p>\n<\/div>\n\nPerformance boards<\/h4>\n
<\/p>\nA board that transmits the necessary test signal between the probe card and test head during semiconductor electric performance inspections. Lincstech’s printed wiring boards enable high quality inspection, making them suitable for performance boards.<\/p>\n<\/div>\n
\nDigital swtiching systems<\/h4>\n
<\/p>\nAs IP telephony progresses, the demand for telephone switchboards (PBX) that use internet connections is expanding. Use high quality PWBs to achieve clear, reliable communications.<\/p>\n<\/div>\n
\nServers<\/h4>\n
<\/p>\nLincstech’s PWBs make communications speeds faster, further improving server data processing speeds. The major companies supporting the high speed communications industry use these PWBs. Lincstech’s unique technology is at work here, too.<\/p>\n<\/div>\n
\nIndustrial equipment<\/h4>\n
<\/p>\nLincstech PWBs providing both high density wiring and high reliability are an excellent match for industrial machines that propel automation and productivity improvements. Lincstech has a long history of supporting makers across the spectrum in their development work.<\/p>\n<\/div>\n<\/div>\n