{"id":35,"date":"2024-08-17T18:00:40","date_gmt":"2024-08-17T09:00:40","guid":{"rendered":"https:\/\/fvn-office.net\/grannet\/P-120779\/english\/?page_id=35"},"modified":"2024-12-25T14:19:56","modified_gmt":"2024-12-25T05:19:56","slug":"highprecision","status":"publish","type":"page","link":"https:\/\/www.lincstech.com\/english\/product\/highprecision\/","title":{"rendered":"3D Substrate"},"content":{"rendered":"<div class=\"sub_top_info sub_product\">\n<div class=\"inner\">\n<h2 class=\"cus_ttl3\"><span class=\"ja\">Product Outline<\/span><\/h2>\n<div class=\"sub_prd_ct\">\n<ul class=\"list_check\">\n<li>Excellent copper plating technology; can be made to match any shape<\/li>\n<li>Miniaturization and compactness are possible while maintaining stable high frequency characteristics, so finds a lot of uses in sensors<\/li>\n<\/ul>\n<div class=\"sub_tag\">\n<p>Manufacturing locations\uff1a<span>Ishioka Plant<\/span><\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<div class=\"product_content\">\n<div class=\"inner\">\n<section class=\"clearfix\">\n<h2 class=\"cus_ttl3 center\"><span class=\"ja\">Features<\/span><\/h2>\n<div class=\"product_point\">\n<div class=\"point_item line3\">\n<div class=\"des\">\n<p class=\"big\"><span class=\"num\">01<\/span>Variety of shapes possible<\/p>\n<p> With excellent copper plating technology, flexible bump formation is possible. <br \/>Example 1) Height: 180\u03bcm \/ Diameter: 250\u03bcm<br \/>(Minimum: height: 150\u03bcm \/ Diameter 170\u03bcm)<br \/>Example 2) Height: 20\u03bcm \/ Size: 0.15 x 9.0mm<\/p>\n<\/div>\n<div class=\"img\">\n<p><img decoding=\"async\" src=\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/hight_img_1.jpg\" alt=\"Variety of shapes possible\"><\/p>\n<p><img decoding=\"async\" src=\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/hight_img_2.jpg\" alt=\"Variety of shapes possible\"><\/p>\n<\/div>\n<\/div>\n<div class=\"point_item line2\">\n<div class=\"des\">\n<p class=\"big\"><span class=\"num\">02<\/span>Product becomes more compact and high frequency characteristics improved<\/p>\n<p>Cavity structure is made possible by high precision counterboring. Components can be mounted inside the cavity directly, allowing for more compact design and improved high frequency performance.<\/p>\n<\/div>\n<div class=\"img\">\n<p class=\"img\"><img decoding=\"async\" src=\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/hight_img_3.jpg\" alt=\"Product becomes more compact and high frequency characteristics improved\"><\/p>\n<p class=\"img\"><img decoding=\"async\" src=\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/hight_img_4.jpg\" alt=\"Product becomes more compact and high frequency characteristics improved\"><\/p>\n<\/div>\n<\/div>\n<div class=\"point_item start\">\n<div class=\"des\">\n<p class=\"big\"><span class=\"num\">03<\/span>Smaller size and space saving by using wire bondable stack vias<\/p>\n<p>Our high-precision 3D circuit boards are compact, featuring stacked vias that allow for stacking while ensuring flatness. And wire bonding is possible, so the product can be made more compact while ensuring reliability.<\/p>\n<\/div>\n<div class=\"img\">\n<p class=\"img\"><img decoding=\"async\" src=\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/hight_img_5.jpg\" alt=\"Smaller size and space saving by using wire bondable stack vias\"><\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/section>\n<section class=\"clearfix\">\n<h3 class=\"cus_ttl5\">Typical applications<\/h3>\n<div class=\"product_flex\">\n<div class=\"product_flex_it\">\n<h4 class=\"big\">Module substrates<\/h4>\n<p class=\"img\"><img decoding=\"async\" src=\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/hight_flex_1.jpg\" width=\"160\" alt=\"Module substrates\"><\/p>\n<p>Lincstech&#8217;s high density, high reliability substrates are ideal for the high performance power modules, multi chip modules, and other modules essential for smartphones and other electronic devices.<\/p>\n<\/div>\n<div class=\"product_flex_it\">\n<h4 class=\"big\">Sensors<\/h4>\n<p class=\"img\"><img decoding=\"async\" src=\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/hight_flex_2.jpg\" width=\"160\" alt=\"Sensors\"><\/p>\n<p>High accuracy sensors are indispensable in applications like self-driving vehicles, industrial equipment and robots. Lincstech&#8217;s substrates with high density signal lines contribute to the development of smaller, more accurate sensors.<\/p>\n<\/div>\n<div class=\"product_flex_it\">\n<h4 class=\"big\">LEDs<\/h4>\n<p class=\"img\"><img decoding=\"async\" src=\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/hight_flex_3.jpg\" width=\"160\" alt=\"LEDs\"><\/p>\n<p>Energy-efficient LEDs have become the mainstay in the lighting of modern society. Lincstech&#8217;s substrates, with their small form factor and complex wiring, play a part in developing brighter, smaller LED products.<\/p>\n<\/div>\n<\/div>\n<p class=\"btn btn_b center\"><a href=\"https:\/\/www.lincstech.com\/english\/product\/\">Product Lineup<\/a><\/p>\n<\/section>\n<\/div>\n<div class=\"box_banner\">\n<p class=\"item bg_strength\"><a href=\"https:\/\/www.lincstech.com\/english\/strength\/\">Lincstech\u2019s <br class=\"sp\"> Strengths<\/a><\/p>\n<p class=\"item bg_pwb\"><a href=\"https:\/\/www.lincstech.com\/english\/topics\/aboutpwb\/\">What are printed wiring boards?<\/a><\/p>\n<p class=\"item bg_dt_pwb\"><a href=\"https:\/\/www.lincstech.com\/english\/topics\/detailpwb\/\">Basic Knowledge of PWB<\/a><\/p>\n<p class=\"item bg_story\"><a href=\"https:\/\/www.lincstech.com\/english\/strength\/#strength_ttl02\">Development Story<\/a><\/p>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>Product Outline Excellent copper plating technology; can be made to match any shape Miniaturization and compac [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":29,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-35","page","type-page","status-publish","hentry"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v26.6 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>3D Substrate | Lincstech Co., Ltd.<\/title>\n<meta name=\"description\" content=\"This is a page that introduces Lincstech&#039;s&#039;3D Substrate&#039;. 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