{"id":40,"date":"2024-08-17T18:01:50","date_gmt":"2024-08-17T09:01:50","guid":{"rendered":"https:\/\/fvn-office.net\/grannet\/P-120779\/english\/?page_id=40"},"modified":"2025-04-08T13:58:41","modified_gmt":"2025-04-08T04:58:41","slug":"bbct","status":"publish","type":"page","link":"https:\/\/www.lincstech.com\/english\/product\/bbct\/","title":{"rendered":"Board to board connected PWB"},"content":{"rendered":"<div class=\"sub_top_info sub_product\">\n<div class=\"inner\">\n<h2 class=\"cus_ttl3\"><span class=\"ja\">Product Outline<\/span><\/h2>\n<div class=\"sub_prd_ct\">\n<ul class=\"list_check\">\n<li>Small hole diameter allows more space for wiring between holes.<\/li>\n<li>More space for wires means a large improvement in wiring design freedom.<\/li>\n<li>Thicker boards can be achieved easily.<\/li>\n<li>Signal wiring densities not possible with MWB (multi wiring boards) achieved.<\/li>\n<li>IVH stubs are minimized for to allow higher speeds.<br \/>Even higher speeds are possible when combined with inner back drilling.<\/li>\n<\/ul>\n<div class=\"sub_tag\">\n<p>Manufacturing locations\uff1a<span>Shimodate Plant<\/span><\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<div class=\"product_content\">\n<div class=\"inner\">\n<section class=\"clearfix\">\n<h2 class=\"cus_ttl3 center\"><span class=\"ja\">Features<\/span><\/h2>\n<div class=\"product_point\">\n<div class=\"point_item\">\n<div class=\"des\">\n<p class=\"big\"><span class=\"num\">01<\/span> Improved wiring design margin and dramatically increased number of wires in a given area<\/p>\n<p>By replacing through holes with IVH, hole diameter can be reduced, allowing more wires to be placed between holes. And unnecessary through holes are removed (only necessary vias are replaced with IVH), increasing the space for wiring and greatly improving wiring design margin.<\/p>\n<\/div>\n<div class=\"img\">\n<p><img decoding=\"async\" src=\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/bbct_img_1.jpg\" alt=\" Improved wiring design margin and dramatically increased number of wires in a given area\"><\/p>\n<\/div>\n<\/div>\n<div class=\"point_item\">\n<div class=\"des\">\n<p class=\"big\"><span class=\"num\">02<\/span>Higher speed<br \/>Combination of IVH stacked structure and inner back drilling<\/p>\n<p>By placing IVH in a stacked structure, the stubs produced by conventional vias are minimized, allowing for high speed operation. Even higher speeds are possible if combined with inner back drilling.<\/p>\n<\/div>\n<div class=\"img\">\n<p class=\"img\"><img decoding=\"async\" src=\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/bbct_img_2.jpg\" alt=\"Higher speed. Combination of IVH stacked structure and inner back drilling\"><\/p>\n<\/div>\n<\/div>\n<div class=\"point_item line2\">\n<div class=\"des\">\n<p class=\"big\"><span class=\"num\">03<\/span>Ultra-high layer counts and high board thickness not possible with conventional manufacturing processes<\/p>\n<p>Limitations on manufacturing equipment and product specifications (hole diameter, copper plating, etc.) restricted maximum thickness to 7.7mm. With this technology, thickness in excess of 7.7mm is made possible by first making sub boards, and then stacking them with conductive paste between the boards to connect them. At the same time, ultra-high layer counts of over 100 layers are made possible.<\/p>\n<\/div>\n<div class=\"img\">\n<p class=\"img\"><img decoding=\"async\" src=\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/bbct_img_3.jpg\" alt=\"Ultra-high layer counts and high board thickness not possible with conventional manufacturing processes\"><\/p>\n<\/div>\n<\/div>\n<div class=\"point_item\">\n<div class=\"des\">\n<p class=\"big\"><span class=\"num\">04<\/span>An environmentally-friendly process<\/p>\n<p>Compared to conventional  PWBs with mixed through holes and IVH, board to board connected PWBs made with IVH need fewer copper plating steps. And by performing electrical inspection of the sub boards at the time they are finished, problems can be detected at an early stage and defective  PWBs discarded, reducing the overall waste, resulting in an environmentally-friendly process.<\/p>\n<\/div>\n<div class=\"img\">\n<p class=\"img\"><img decoding=\"async\" src=\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/bbct_img_4.jpg\" alt=\"An environmentally-friendly process\"><\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/section>\n<section class=\"clearfix\">\n<h2 class=\"cus_ttl3 center mba20\"><span class=\"ja\">Technology roadmap<\/span><\/h2>\n<\/section>\n<section class=\"clearfix\">\n<h3 class=\"cus_ttl5 mb20sp\">\u3010Multi Wiring Board\u3011<\/h3>\n<p class=\"sp tb_note\"><span class=\"f_sm\">*The table can be viewed by scrolling left and right.<\/span><\/p>\n<div class=\"tb_scroll mb15\">\n<table class=\"tb_fix tb_border center\">\n<tr>\n<th colspan=\"2\" class=\"w25\">Item<\/th>\n<th>2024<\/th>\n<th>2025<\/th>\n<th>2026<\/th>\n<\/tr>\n<tr>\n<td class=\"w10\" rowspan=\"2\">Book Count<\/td>\n<td class=\"w15\">2 Books<\/td>\n<td colspan=\"3\">\n<div class=\"tb_arr arr_b\">\n<p>\u2266 t7.4mm<\/p>\n<\/div>\n<\/td>\n<\/tr>\n<tr>\n<td class=\"w15 no_bdl\">3 Books<\/td>\n<td>\n<div class=\"tb_arr arr_b\">\n<p>\u2266 t7.4mm<\/p>\n<\/div>\n<\/td>\n<td colspan=\"2\">\n<div class=\"tb_arr \">\n<p>\u2266 t12.0mm<\/p>\n<\/div>\n<\/td>\n<\/tr>\n<tr>\n<td colspan=\"2\">Connection min. Pitch<\/td>\n<td colspan=\"2\">\n<div class=\"tb_arr\">\n<p>0.80mm<\/p>\n<\/div>\n<\/td>\n<td>\n<div class=\"tb_arr\">\n<p>0.65mm<\/p>\n<\/div>\n<\/td>\n<\/tr>\n<tr>\n<td rowspan=\"2\" colspan=\"2\">Routing density<\/td>\n<td colspan=\"3\">\n<div class=\"tb_arr arr_b\">\n<p>2 wires \/ 0.8mm , 1 wire \/ 0.65mm (\u03a60.065 wire)<\/p>\n<\/div>\n<\/td>\n<\/tr>\n<tr>\n<td colspan=\"3\" class=\"no_bdl\">\n<div class=\"tb_arr\">\n<p>2wires\/0.7mm (\u03a60.050 wire)<\/p>\n<\/div>\n<\/td>\n<\/tr>\n<tr>\n<td rowspan=\"2\" colspan=\"2\" class=\"bd_bot\">Min. Drill dia.<\/td>\n<td colspan=\"3\">\n<div class=\"tb_arr arr_b\">\n<p>\u03a60.25 (\u03a60.065 wire)<\/p>\n<\/div>\n<\/td>\n<\/tr>\n<tr>\n<td colspan=\"3\" class=\"no_bdl\">\n<div class=\"tb_arr\">\n<p>\u03a60.20 (\u03a60.050 wire)<\/p>\n<\/div>\n<\/td>\n<\/tr>\n<\/table>\n<\/div>\n<\/section>\n<section class=\"clearfix\">\n<h3 class=\"cus_ttl5 mb20sp\">\u3010Multi Layer Board\u3011<\/h3>\n<p class=\"sp tb_note\"><span class=\"f_sm\">*The table can be viewed by scrolling left and right.<\/span><\/p>\n<div class=\"tb_scroll mb15\">\n<table class=\"tb_fix tb_border center\">\n<tr>\n<th colspan=\"2\" class=\"w25\">Item<\/th>\n<th>2024<\/th>\n<th>2025<\/th>\n<th>2026<\/th>\n<\/tr>\n<tr>\n<td class=\"w10\" rowspan=\"2\">Book Count <\/td>\n<td class=\"w15\">2 Books<\/td>\n<td colspan=\"3\">\n<div class=\"tb_arr arr_b\">\n<p>\u2266 t7.4mm<\/p>\n<\/div>\n<\/td>\n<\/tr>\n<tr>\n<td class=\"w15 no_bdl\">3 Books<\/td>\n<td>\n<div class=\"tb_arr arr_b\">\n<p>\u2266 t7.4mm<\/p>\n<\/div>\n<\/td>\n<td colspan=\"2\">\n<div class=\"tb_arr \">\n<p>\u2266 t12.0mm<\/p>\n<\/div>\n<\/td>\n<\/tr>\n<tr>\n<td colspan=\"2\">Connection min. Pitch<\/td>\n<td colspan=\"2\">\n<div class=\"tb_arr\">\n<p>0.80mm<\/p>\n<\/div>\n<\/td>\n<td>\n<div class=\"tb_arr\">\n<p>0.65mm<\/p>\n<\/div>\n<\/td>\n<\/tr>\n<tr>\n<td colspan=\"2\">Min. Drill dia.<\/td>\n<td>\n<div class=\"tb_arr arr_b\">\n<p>\u03a60.20<\/p>\n<\/div>\n<\/td>\n<td colspan=\"2\" class=\"no_bdl\">\n<div class=\"tb_arr\">\n<p>\u03a60.15<\/p>\n<\/div>\n<\/td>\n<\/tr>\n<\/table>\n<\/div>\n<\/section>\n<section class=\"clearfix\">\n<h3 class=\"cus_ttl5\">Typical applications<\/h3>\n<div class=\"product_flex\">\n<div class=\"product_flex_it\">\n<h4 class=\"big\">Probe cards<\/h4>\n<p class=\"img\"><img decoding=\"async\" src=\"https:\/\/www.lincstech.com\/english\/wp-content\/themes\/lincstech\/images\/product\/bbct_flex_1.jpg\" width=\"160\" alt=\"Probe cards\"><\/p>\n<p>Probe cards are fixtures used to check the quality of wafers used in the semiconductor manufacturing process. The importance of inspection precision is increasing along with semiconductor demand. Lincstech&#8217;s printed wiring boards have the top share in semiconductor inspection processes.  <\/p>\n<\/div>\n<\/div>\n<p class=\"btn btn_b center\"><a href=\"https:\/\/www.lincstech.com\/english\/product\/\">Product Lineup<\/a><\/p>\n<\/section>\n<\/div>\n<div class=\"box_banner\">\n<p class=\"item bg_strength\"><a href=\"https:\/\/www.lincstech.com\/english\/strength\/\">Lincstech\u2019s <br class=\"sp\"> Strengths<\/a><\/p>\n<p class=\"item bg_pwb\"><a href=\"https:\/\/www.lincstech.com\/english\/topics\/aboutpwb\/\">What are printed wiring boards?<\/a><\/p>\n<p class=\"item bg_dt_pwb\"><a href=\"https:\/\/www.lincstech.com\/english\/topics\/detailpwb\/\">Basic Knowledge of PWB<\/a><\/p>\n<p class=\"item bg_story\"><a href=\"https:\/\/www.lincstech.com\/english\/strength\/#strength_ttl02\">Development Story<\/a><\/p>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>Product Outline Small hole diameter allows more space for wiring between holes. More space for wires means a l [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":29,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-40","page","type-page","status-publish","hentry"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v26.6 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Board to Board connected PWB | Lincstech Co., Ltd.<\/title>\n<meta name=\"description\" content=\"This is a page that introduces Lincstech&#039;s&#039;Board to Board connected PWB&#039;. 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