For over 40 years, we have evolved our “Multi-Wiring Board (MWB)” technology to produce a PWB that would the equivalent of an MLB of +100 layers(*1). In order to respond to the increasing demand for greater wire density and the performance stability at high frequencies, we are promoting the development of smaller wire diameters and new interlayer bonding technologies. With these developments, we will be able to continue providing our customers with PWBs that cannot be achieved with a standard process PWB. MWB has the potential to realize a world that does not yet exist.
(*1) Converted to our MLB (Standard PWB manufacturing process)

Because MWB uses wires with excellent dimensional accuracy, a more stable characteristic impedance can be obtained than conventional PWB formed by etching Cu foil. Similarly, signal line resistance can be reduced by 70%.

MWB can prevent crosstalk problems easily by various wiring designs, such as slanting wiring, specifying wiring planes, limiting the length of parallel wires, and pairing with ground wires.

Aspect ratio is available till 30.

MWB allows cross wiring and does not have via holes, so it is easy to synchronize signals by equal length wiring or solid wiring.

Adhere wires on laminate board.

MWB can be cross-wired vertically, horizontally, and diagonally, and the wiring capacity per layer is large, so the number of signal layers can be reduced, and at the same time, the total number of GNDs for impedance control can be reduced.

PWR and GND pattern is formed with 2oz copper foil, so that provide enough electric capacity, perform shield effect as well. Multi layer is available due to different current.

Routing wire continuously with vertical/horizontal, and diagonal, a shortest wiring path could be made.

Using insulated wires, dielectric strength at cross point is more than 500V, so that it is safe to cross.

Can choose in your requirement, common material, high-frequency material, etc.