MWB
(Multi Wiring Board)
Printed wiring boards that employ our original technology to achieve high design freedom, high layer count and high density
Fewer waste products and liquids than conventional PWBs for an environmentally-friendly process
Product Outline
- Crossing wires made possible with polyimide-coated copper wires.
Realizing high density wiring and reduced layer count - A high degree of wiring design freedom and ease of isometric length wiring
- Uniform copper wires used in the signal wiring reduce electrical characteristics variability
Low variability among manufacturing lots ensure stable characteristics
Manufacturing locations：Shimodate Plant
Features
01Wiring resistance reduced by nearly 70%
Because MWB uses high-precision wires with a diameter tolerance of +/- 3 μm, impedance stability is superior to the signal lines of conventional etched steel foil wiring boards. In addition, signal line resistance per 254mm (10 inches) can be reduced by as much as 70%.
02Insulated wires
Diameter is selectable to match the application
Users can choose among wire diameters of 65μm, 80μm, and 100μm. We also have begun offering 50μm wire in small quantities, so please feel free to let us know your needs.
03Reduced crosstalk
MWB allows for easy implementation of many design strategies to reduce crosstalk: diagonal wiring, specification of wiring plane, restrictions on length of parallel wire length, pairing with ground lines, among others.
04Aspect ratios up to 30
By thru-hole plating, we cover a broad range of aspect ratios.
05Easy signal synchronization
MWB allows crossed wiring without thru-holes, so signal synchronization by techniques such as isometric length wiring and solid pattern wiring can be done easily.
06High layer count PWBs can be made denser
MWB allows horizontal, vertical and diagonal wiring in a plane for increased wiring density, which enables not only signal layer count reduction, but ground layers can also be reduced for impedance control.
07Concurrent wiring to achieve the shortest wiring path
Horizontal, vertical and diagonal wiring are continuous to obtain the shortest wiring path.
08Wire intersection insulation can withstand over 500V.
Crossing wires is no problem
Insulated wires are used, so insulation strength where wires cross is not an issue.
09Ample current carrying capacity and shielding of power supply and internal layers
Power supply and ground patterns are formed by 18μm thick copper foil for plenty to current handling and shielding. Current can also be distributed among multiple layers.
MWB (multi wiring board) manufacturing process
- 1Circuit formation
- After forming the circuit on a copper-clad laminate, an adhesive sheet is attached, and the copper wiring is formed on top. After the copper wiring, a visual inspection is performed, after which the multi wiring unit is formed with a copper foil lamination.
- 2Lamination press
- After forming the circuit on the multi wiring unit surface, multiple multi wiring units are laminated together.
- 3Hole drilling
- The pressed laminates are drilled to form the holes.
- 4Plating
- The circuits on each layer are connecting with plated thru holes.
- 5Outer layer formation
- The outer layer circuit is formed on the plated multilayer board.
- 6Open/Short test
- Check is done on a open/short test fixture. After surface treatment and visual inspection both cleared, the PWBs are finally shipped.
Typical applications
Probe cards
Probe cards are fixtures used to check the quality of wafers used in the semiconductor manufacturing process. The importance of inspection precision is increasing along with semiconductor demand. Lincstech’s printed wiring boards have the top share in semiconductor inspection processes.
IC testers
These fixtures are used in the quality and condition tests in the IC manufacturing process. In order to reduce cost, multiple DUTs must be tested at once while maintaning test accuracy. Lincstech PWB’s high wiring density allows simultaneous and accurate testing of multiple DUTs
※DUT: Device Under Test
