We continue to develop our Printed Wiring Board (PWB) core manufacturing process and unique advanced technologies to contribute to the enhancement and differentiation of our customers products. In addition, we work with PWB material and process vendors with the intention to improve our product and enhance quality.
High Layer PWB
We offer our Multi-Wiring Board (MWB), which utilizes our proprietary technology, and standard PWB process technology, Multi-Layer Board (MLB) with high-layer and high-density capability. Our products are applied in a wide range of fields such as semiconductor test and high-performance communication equipment.
Thin Substrate
With our Build-Up substrates, we are developing technologies to address needs for thin substrates and heat dissipation. In addition, we can support high-precision 3D substrates with our copper bump and cavity structure technologies.
These technologies are allowing us to contribute to our partners development of low height modules and 3D component assembly offerings.
“No limits on the form of development” is our style. Please refer to “our strengths” for details
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