Our build-up substrate technology enables us to offer a thin multi-layer PWB based on our unique processing technology while also offering odd-layer structures (full stack-up structure).
Feature
Reduction of substrate thickness.
Fine pitch of blind via holes (IVH) in the build-up layer.
Our copper plating technology enable us to realize IVH stack structure. In addition, we can provide a substrate with excellent heat dissipation for ICs by stacking vias.
Application
Various Modules / Sensor / LED
Contact
