With our MLB (Multi-Layer Board) technology, we can produce a high-layer and high-density PWB. This is realized by lamination, drilling, plating technologies and high precision simulation. Additionally, combining back drilling and/or high frequency materials can further improve the electrical performance of our PWBs for high-frequency applications.
Feature
Combining our simulation technology and multi-layer lamination technology, we successfully produced a 96 layer / 7.4mm thick PWB.
The maximum product size of 600 x 550mm is available.
Our original electroless copper plating process demonstrates excellent throwing power.
The combination of backdrilled stubless vias and high frequency materials can achieve excellent electrical characteristics that can operate in high-frequency environments.
Application
Testing: Probe card / IC tester / Performance board
Communications: Router / Switchboard / Server
Industrial: Machine tools
Contact
